Vapour hydrofluoric acid (HF) etcher

KTH is seeking tenders for a Vapour hydrofluoric acid etcher. The principal application of the instrument is to employ anhydrous hydrofluoric acid (aHF) for etching sacrificial silicon dioxide (SiO₂) with very high selectivity, and without stiction in the release etch of microelectromechanical (MEMS) devices made in silicon (Si), poly-Si, and aluminium (Al) structural materials.

Purpose of procurement

KTH is seeking tenders for one etching instrument that uses anhydrous hydrofluoric acid (aHF) vapour to etch sacrificial silicon dioxide (SiO₂) in the release etch of microelectromechanical (MEMS) devices.

The content of this invitation to tender is an upgrade of the KTH clean-room free-etching capabilities. The activities of the main users of this tool are primarily focusing on microfabrication of MEMS and photonics devices.