Flipchip bonder for assembly of semiconductor components

Flipchip bonder for assembly of semiconductor components.

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Lot nr.: 1

General requirements

Flipchip bonder

Last tender date: 06/05/2024 21:59:59

Type of contract: Supplies

Authority: Chalmers Tekniska Högskola Aktiebolag

Document URL: https://tendsign.com/doc.aspx?MeFormsNoticeId=19101

Tenders URL: https://tendsign.com/doc.aspx?MeFormsNoticeId=19101&GoTo=Tender

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Lot nr.: 2

Tenderer´s suitability

Flipchip bonder

Last tender date: 06/05/2024 21:59:59

Type of contract: Supplies

Authority: Chalmers Tekniska Högskola Aktiebolag

Document URL: https://tendsign.com/doc.aspx?MeFormsNoticeId=19101

Tenders URL: https://tendsign.com/doc.aspx?MeFormsNoticeId=19101&GoTo=Tender