Flipchip bonder for assembly of semiconductor components
Chalmers Tekniska Högskola Aktiebolag, GÖTEBORG
Flipchip bonder for assembly of semiconductor components.
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Lot nr.: 1
General requirements
Flipchip bonder
Last tender date: 06/05/2024 21:59:59
Type of contract: Supplies
Authority: Chalmers Tekniska Högskola Aktiebolag
Document URL: https://tendsign.com/doc.aspx?MeFormsNoticeId=19101
Tenders URL: https://tendsign.com/doc.aspx?MeFormsNoticeId=19101&GoTo=Tender
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Lot nr.: 2
Tenderer´s suitability
Flipchip bonder
Last tender date: 06/05/2024 21:59:59
Type of contract: Supplies
Authority: Chalmers Tekniska Högskola Aktiebolag
Document URL: https://tendsign.com/doc.aspx?MeFormsNoticeId=19101
Tenders URL: https://tendsign.com/doc.aspx?MeFormsNoticeId=19101&GoTo=Tender
(2024-06-05)
Öppet
2024-05-08
Meddelande om upphandling
Västra Götalands län
C 2024-0272